Invention Application
- Patent Title: DEPLOYABLE ELECTRODE ARRAY LEAD ASSEMBLY FOR IMPLANTABLE ELECTRICAL STIMULATION
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Application No.: US17873003Application Date: 2022-07-25
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Publication No.: US20220355099A1Publication Date: 2022-11-10
- Inventor: Richard T. Stone , Michael T. Hegland
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61N1/36

Abstract:
A lead assembly includes a central lead member having a distal portion configured to extend along a longitudinal axis. The lead assembly also includes two or more side lead members disposed around the central lead member. Each side lead member includes a deploying portion extending at an angle away from the longitudinal axis. Each deploying portion has a proximal portion and a distal portion. The distal portion is laterally spaced from the central lead member and extends more parallel to the longitudinal axis than the proximal portion. The lead assembly also includes one or more electrodes attached to the distal portion of the deploying portion of each side lead member. The lead assembly optionally includes a cannula comprising a lumen, an end portion, and a buckler disposed in the lumen on the end portion for deploying the lead members.
Public/Granted literature
- US11904161B2 Deployable electrode array lead assembly for implantable electrical stimulation Public/Granted day:2024-02-20
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