Invention Application
- Patent Title: MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
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Application No.: US17566067Application Date: 2021-12-30
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Publication No.: US20220359976A1Publication Date: 2022-11-10
- Inventor: Yiqi Tang , Rajen Manicon Murugan , Juan Herbsommer
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01Q19/10 ; H01Q9/04

Abstract:
In a described example, an apparatus includes: a patch antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the patch antenna.
Information query