Invention Application
- Patent Title: ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD
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Application No.: US17871266Application Date: 2022-07-22
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Publication No.: US20220361319A1Publication Date: 2022-11-10
- Inventor: Haekeu PARK , Hyeonyeong JEONG , Sunghoon CHO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0013976 20200205
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H04R3/00 ; H04R1/10 ; H04R1/08

Abstract:
An electronic device includes a microphone module and a printed circuit board on which the microphone module is disposed. The printed circuit board includes a first layer having at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and a second layer disposed under the first layer and having a second ground opposite to the first microphone pad and at least a part of the first ground.
Information query