Invention Application
- Patent Title: CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
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Application No.: US17431917Application Date: 2021-08-13
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Publication No.: US20220361335A1Publication Date: 2022-11-10
- Inventor: Seungbo SHIM , Junghoon PARK , Dongil SON
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Priority: KR10-2020-0103172 20200818
- International Application: PCT/KR2021/010808 WO 20210813
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/18 ; H05K1/02 ; H05K7/14 ; H04M1/02

Abstract:
According to various embodiments of the disclosure, an electronic device may comprise: a display, a first circuit board disposed under the display, at least one component disposed on one surface of the first circuit board, an interposer surrounding at least two sides of the at least one component and disposed on the first circuit board, and a second circuit board spaced apart from the first circuit board and including an area joined with the interposer. The interposer may include: a first interposer portion disposed along a first area of the first circuit board, a first end of the first interposer having at least a portion including a non-shielding area, and a second interposer portion disposed along a second area, adjacent to the first area, of the first circuit board, a second end of the second interposer facing the first end and having at least a portion including a non-shielding area.
Public/Granted literature
- US11974397B2 Circuit board module and electronic device including the same Public/Granted day:2024-04-30
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