Invention Application
- Patent Title: Electronic Device Cover and Electronic Device Component
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Application No.: US17871404Application Date: 2022-07-22
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Publication No.: US20220361346A1Publication Date: 2022-11-10
- Inventor: Yinzhong Tang , Na Wang , Shanjiu Chi , Zhengquan Wang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN202010076923.0 20200123,CN202010089378.9 20200212
- Main IPC: H05K5/02
- IPC: H05K5/02

Abstract:
An electronic device cover is configured to accommodate an electronic device. A first air intake window and a first air exhaust window are disposed on the electronic device cover. The first air intake window is configured to communicate with an air intake vent of the electronic device to form an air intake channel, and the first air exhaust window is configured to communicate with an air exhaust vent of the electronic device to form an air exhaust channel. An air return channel is disposed inside the electronic device, and the air return channel is configured to communicate the air exhaust channel and the air intake channel.
Public/Granted literature
- US12262486B2 Electronic device cover and electronic device component Public/Granted day:2025-03-25
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