- 专利标题: PHOTONIC INTEGRATED CIRCUIT (PIC) PACKAGE
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申请号: US17763381申请日: 2020-09-24
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公开(公告)号: US20220365296A1公开(公告)日: 2022-11-17
- 发明人: Pavel Mamyshev
- 申请人: IPG PHOTONICS CORPORATION
- 申请人地址: US MA OXFORD
- 专利权人: IPG PHOTONICS CORPORATION
- 当前专利权人: IPG PHOTONICS CORPORATION
- 当前专利权人地址: US MA OXFORD
- 国际申请: PCT/US20/52377 WO 20200924
- 主分类号: G02B6/42
- IPC分类号: G02B6/42
摘要:
A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.