Invention Application
- Patent Title: GEOMETRIC STRUCTURES FOR ACOUSTIC IMPEDANCE MATCHING AND IMPROVED TOUCH SENSING AND FINGERPRINT IMAGING
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Application No.: US17660308Application Date: 2022-04-22
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Publication No.: US20220366719A1Publication Date: 2022-11-17
- Inventor: Daniel J. HIEMSTRA , George Ho Yin MAK , Ehsan KHAJEH , Camille L. EVERHART
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: G06V40/13
- IPC: G06V40/13 ; G06F3/043 ; G06F3/041 ; G10K11/02

Abstract:
Improving the accuracy of ultrasonic touch sensing and fingerprint imaging using acoustic impedance matching is disclosed. Acoustic impedance mismatches between an ultrasonic transducer array and a sensing plate can be reduced to maximize energy transfer and minimize parasitic reflections. A reduction in acoustic impedance mismatches can be accomplished using (i) a composite epoxy having a higher acoustic impedance than epoxy alone, (ii) one or more matching layers having an acoustic impedance that is approximately the geometric mean of the acoustic impedance of the sensing plate and the acoustic impedance of the transducer array, (iii) pores or perforations in the sensing plate, or (iv) geometric structures formed in the sensing plate. In addition, parasitic reflections can be suppressed using an absorbent layer.
Public/Granted literature
- US11715321B2 Geometric structures for acoustic impedance matching and improved touch sensing and fingerprint imaging Public/Granted day:2023-08-01
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