- 专利标题： METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION STRUCTURE
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申请号： US17815950申请日： 2022-07-29
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公开(公告)号： US20220367313A1公开(公告)日： 2022-11-17
- 发明人: Jia-Liang CHEN , Chi-Ming YANG , Yen-Chao LIN
- 申请人： GLOBAL UNICHIP CORPORATION , TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW HSINCHU CITY; TW Hsinchu
- 专利权人： GLOBAL UNICHIP CORPORATION,TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： GLOBAL UNICHIP CORPORATION,TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW HSINCHU CITY; TW Hsinchu
- 优先权： TW110105549 20210218
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L21/48 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/373
摘要：
A manufacturing method of a semiconductor packaging device is provided, and the manufacturing method includes steps as follows. A working chip is soldered on one surface of a wiring board so that an working circuit inbuilt inside a chip body of the working chip is electrically connected to the wiring board. A silicon thermal conductivity element is soldered on one surface of a heat-dissipating metal lid. The heat-dissipating metal lid is fixedly covered on the wiring board such that the silicon thermal conductivity element is sandwiched between the chip body and the heat-dissipating metal lid, and the silicon thermal conductivity element is electrically isolated from the working circuit of the chip body and the wiring board.
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