Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
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Application No.: US17324965Application Date: 2021-05-19
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Publication No.: US20220373670A1Publication Date: 2022-11-24
- Inventor: Yuanhao YU , Chung Ju YU , Wei-Fan WU , Chai-Chi LIN , Hong Jie CHEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: G01S13/58
- IPC: G01S13/58 ; H01L25/16 ; H01Q1/27

Abstract:
At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.
Information query