Invention Application
- Patent Title: ELECTRONIC DEVICE COMPRISING HEAT RADIATING STRUCTURE
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Application No.: US17882418Application Date: 2022-08-05
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Publication No.: US20220377875A1Publication Date: 2022-11-24
- Inventor: Chung-Hyo JUNG , Kang-Sik KIM , Young-San KIM , Won-Min KIM , Chi-Hyun CHO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2017-0149637 20171110
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K7/20 ; H05K9/00 ; H05K1/18

Abstract:
According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
Public/Granted literature
- US11700711B2 Electronic device comprising heat radiating structure Public/Granted day:2023-07-11
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