A device includes a molten metal pump and a metal-transfer conduit. A clamp may be used to attach the metal-transfer conduit to the pump. The pump has a pump base including an indentation configured to receive the metal-transfer conduit and align the pump outlet with the transfer inlet. The pump outlet may be formed in the indentation and preferably near the center of the indentation in order to better align with the transfer inlet. As the pump operates it moves molten metal through a pump outlet that is in communication with a transfer inlet in the metal-transfer conduit. The molten metal enters the transfer inlet, moves upwards in a passage in the metal-transfer conduit, and out of a transfer outlet.