Invention Application
- Patent Title: AIR GAP FORMATION BETWEEN GATE SPACER AND EPITAXY STRUCTURE
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Application No.: US17885383Application Date: 2022-08-10
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Publication No.: US20220384442A1Publication Date: 2022-12-01
- Inventor: Bo-Yu LAI , Kai-Hsuan LEE , Wei-Yang LEE , Feng-Cheng YANG , Yen-Ming CHEN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L21/8234

Abstract:
A semiconductor device includes a gate stack, an epitaxy structure, a first spacer, a second spacer, and a dielectric residue. The gate stack is over a substrate. The epitaxy structure is formed raised above the substrate. The first spacer is on a sidewall of the gate stack. The first spacer and the epitaxy structure define a void therebetween. The second spacer seals the void between the first spacer and the epitaxy structure. The dielectric residue is in the void and has an upper portion and a lower portion under the upper portion. The upper portion of the dielectric residue has a silicon-to-nitrogen atomic ratio higher than a silicon-to-nitrogen atomic ratio of the lower portion of the dielectric residue.
Public/Granted literature
- US11855097B2 Air gap formation between gate spacer and epitaxy structure Public/Granted day:2023-12-26
Information query
IPC分类: