Invention Application
- Patent Title: MULTI-LAYER STACKED CAMERA-IMAGE-SENSOR CIRCUIT
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Application No.: US17728880Application Date: 2022-04-25
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Publication No.: US20220408049A1Publication Date: 2022-12-22
- Inventor: Ziyun Li , Barbara De Salvo , Xinqiao Liu , Lyle David Bainbridge , Andrew Samuel Berkovich , Syed Shakib Sarwar , Song Chen , Tsung-Hsun Tsai
- Applicant: Meta Platforms Technologies, LLC
- Applicant Address: US CA Menlo Park
- Assignee: Meta Platforms Technologies, LLC
- Current Assignee: Meta Platforms Technologies, LLC
- Current Assignee Address: US CA Menlo Park
- Main IPC: H04N5/369
- IPC: H04N5/369 ; H01L27/146

Abstract:
A stacked camera-image-sensor circuit may include (i) a first layer that includes a plurality of image sensing elements, (ii) a second layer that includes components that interface with the image sensing elements, and (iii) at least one additional layer that includes image-processing components. Various other methods, systems, and computer-readable media are also disclosed.
Information query