Invention Application
- Patent Title: Laminate Transformer with Overlapping Lead Frame
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Application No.: US17363115Application Date: 2021-06-30
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Publication No.: US20230005652A1Publication Date: 2023-01-05
- Inventor: Dongbin Hou , Zhemin Zhang
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01F27/06
- IPC: H01F27/06 ; H01F27/28 ; H01F27/24

Abstract:
An apparatus has a laminate substrate that has a first surface and an opposite second surface. A laminate transformer is located within the laminate substrate between the first surface and the second surface. The transformer has a first coil adjacent the first surface and a second coil adjacent the second surface. A magnetic core element on the first surface overlaps a portion of the first coil. A lead frame on the first surface is spaced apart from the magnetic core element. A portion of the lead frame overlaps a portion of the first coil to provide a thermal conductive path.
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