- 专利标题: ACOUSTIC RESONATOR PACKAGE
-
申请号: US17554326申请日: 2021-12-17
-
公开(公告)号: US20230008635A1公开(公告)日: 2023-01-12
- 发明人: Tae Kyung LEE , Sung HAN , Jae Goon AUM
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2021-0090214 20210709
- 主分类号: H03H9/10
- IPC分类号: H03H9/10 ; H03H9/17
摘要:
An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other. The cap includes a central portion accommodating the acoustic resonator, and an outer portion disposed outside of the central portion and having a bonding surface. The outer portion includes protrusions in contact with the bonding portion, and at least one trench disposed between the protrusions. The acoustic resonator package further includes a first protective layer and a second protective layer, the first protective layer and the second protective layer being disposed on a region of the bonding surface formed on each of the protrusions.
信息查询