- 专利标题: TWO-DIMENSIONAL (2D) METAL STRUCTURE
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申请号: US17371321申请日: 2021-07-09
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公开(公告)号: US20230008779A1公开(公告)日: 2023-01-12
- 发明人: Shih-Wei Peng , Jiann-Tyng Tzeng , Ken-Hsien Hsieh
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L27/085 ; H01L27/092 ; H01L21/768
摘要:
A semiconductor structure includes: a first gate structure and a second gate structure extending in a first direction; a first base level metal interconnect (M0) pattern extending in a second direction perpendicular to the first direction; a second M0 pattern extending in the second direction; a third M0 pattern located between the first and second gate structures and extending in the first direction, two ends of the third M0 pattern connected to the first M0 pattern and the second M0 pattern, respectively; a fourth M0 pattern and a fifth M0 pattern located between the first and second M0 patterns and extending in the second direction. A distance between the fourth M0 pattern and the first M0 pattern in the first direction is equal to a minimum M0 pattern pitch, and a distance between the fourth M0 pattern and the second M0 pattern is equal to the minimum M0 pattern pitch.
公开/授权文献
- US11923300B2 Two-dimensional (2D) metal structure 公开/授权日:2024-03-05
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