Invention Application
- Patent Title: PRINTED CIRCUIT BOARD MODULE
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Application No.: US17782255Application Date: 2020-12-04
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Publication No.: US20230010263A1Publication Date: 2023-01-12
- Inventor: Jeong Heum PARK , Soo Hong KIM , Kwang Soon JUNG
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2019-0164899 20191211
- International Application: PCT/KR2020/017693 WO 20201204
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/16 ; H01F17/00 ; H05K1/05

Abstract:
A printed circuit board module comprises: a first printed circuit board; a second printed circuit board arranged on one surface of the first printed circuit board; a third printed circuit board arranged on the other surface of the first printed circuit board; and a core passing through the first printed circuit board to the third printed circuit board, wherein the second printed circuit board includes a first coil, the third printed circuit board includes a second coil, and the cross-sectional area of the second printed circuit board and the third printed circuit board is less than the cross-sectional area of the first printed circuit board.
Public/Granted literature
- US12193158B2 Printed circuit board module Public/Granted day:2025-01-07
Information query