Invention Application
- Patent Title: BACK COVERS
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Application No.: US17786609Application Date: 2019-12-20
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Publication No.: US20230013869A1Publication Date: 2023-01-19
- Inventor: Chi-Hsuan Hung , Fu-Yi Chen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/067869 WO 20191220
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K7/20
Abstract:
Examples of back covers for devices are described. In an example, the back cover includes an air-vent, and a region of a surface of the back cover directing air dispensed by a cooling unit of the device toward the air-vent.
Information query
