Invention Application
- Patent Title: Semiconductor devices with in-package PGS for coupling noise suppression
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Application No.: US17848417Application Date: 2022-06-24
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Publication No.: US20230014046A1Publication Date: 2023-01-19
- Inventor: Ruey-Bo Sun , Sheng-Mou Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
According to an embodiment of the invention, a semiconductor device comprises a substrate, a semiconductor die and a first shielding structure. The semiconductor die is disposed on the substrate and comprises an electronic device. The first shielding structure is formed outside of the semiconductor die and disposed under the electronic device.
Public/Granted literature
- US1235770A Apparatus for cleaning deep wells. Public/Granted day:1917-08-07
Information query
IPC分类:
