Invention Publication
- Patent Title: Segment Routing MPLS Point To Multipoint Path
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Application No.: US18149514Application Date: 2023-01-03
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Publication No.: US20230143419A1Publication Date: 2023-05-11
- Inventor: Huaimo Chen , Donald Eggleston Eastlake, III
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Main IPC: H04L45/50
- IPC: H04L45/50 ; H04L45/122 ; H04L45/24

Abstract:
Disclosed is a mechanism implemented by an ingress node in a network. The mechanism comprises receiving a packet in Multiprotocol Label Switching (MPLS) format. A first segment list is pushed onto the packet. The first segment list describes a segment routing point to multipoint (SR P2MP) path as a list of multicast segment identifiers (SIDs) each comprising a multicast adjacency label. The packet is transmitted from a downstream interface along the SR P2MP path.
Public/Granted literature
- US12170613B2 Segment routing MPLS point to multipoint path Public/Granted day:2024-12-17
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