Invention Publication
- Patent Title: MOLDED MICROFLUIDIC SUBSTRATE HAVING MICROFLUIDIC CHANNEL
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Application No.: US17912873Application Date: 2020-04-10
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Publication No.: US20230143672A1Publication Date: 2023-05-11
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Michael G. Groh
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2020/027597 2020.04.10
- Date entered country: 2022-09-20
- Main IPC: B01L3/00
- IPC: B01L3/00
Abstract:
A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.
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