Invention Publication
- Patent Title: CONTROL MODULE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
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Application No.: US17296574Application Date: 2020-08-21
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Publication No.: US20230146838A1Publication Date: 2023-05-11
- Inventor: Meizhu Zheng , Yuanyuan Li , Dalin Xiang , Jiuzhen Wang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2020/110573 2020.08.21
- Date entered country: 2021-05-25
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/00
Abstract:
Provided is a control module including a printed circuit board, an IC, and a shielding cover. The shielding cover is provided with a dispensing hole for adhesive dispensing. The IC is soldered onto the printed circuit board, and an adhesive may be dispensed between the IC and the printed circuit board through the dispensing hole. A method for manufacturing a control module is also provided.
Public/Granted literature
- US11848277B2 Control module, method for manufacturing same, and electronic device Public/Granted day:2023-12-19
Information query
IPC分类:
