A machine for embossing, including at least one pair of embossing nips for plies of paper, at least one laminating nip to bond the plies of paper, a pair of embossing cylinders, each having on its surface a respective plurality of embossing protrusions, each defining a wrap angle for the at least one ply of paper, and defining therebetween a transfer nip, a pair of pressure cylinders, each associated with a respective one of the embossing cylinder, the embossing nip being defined between each pair formed of embossing cylinder and pressure cylinder, a laminating device for bonding the plies delivered from the transfer nip, at least one distribution device of material to facilitate ply-bonding arranged upstream of the laminating device, and at least one heating device for at least one of the embossing cylinders.