The present disclosure relates to a laminate, comprising a first film including a pattern of microstructures embossed on a first surface of thereof, each microstructure being arranged at a predetermined distance between adjacent microstructures, and a second film including structures arranged on a first surface thereof at positions corresponding to areas of the first surface of the first film defined by the predetermined distance, wherein when the second film is laminated to the first film, the structures arranged on the first surface of the second film are in contact with the areas of the first surface of the first film defined by the predetermined distance, a height of the structures is greater than a height of each microstructure, and a delta defined therebetween encapsulates a void fill material in at least a portion of at least one void defined by the delta.