Invention Publication
- Patent Title: METHOD FOR TREATING A WOOD SUBSTRATE
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Application No.: US17526526Application Date: 2021-11-15
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Publication No.: US20230150166A1Publication Date: 2023-05-18
- Inventor: Jun Zhang , Peter Tham , Craig Wilson
- Applicant: Koppers Performance Chemicals, Inc.
- Applicant Address: US PA Pittsburgh
- Assignee: Koppers Performance Chemicals, Inc.
- Current Assignee: Koppers Performance Chemicals, Inc.
- Current Assignee Address: US PA Pittsburgh
- Main IPC: B27K3/22
- IPC: B27K3/22

Abstract:
A method for treating a wood substrate is provided. The method comprises contacting the wood substrate in a field application with an aqueous composition. The contacting is performed at a pressure of less than 20 psia. The aqueous composition comprises, by total weight of the aqueous composition, 1.0% to 10.0% by weight of a micronized basic copper carbonate, 0.35% to 2.5% by weight of a quaternary ammonium compound, and at least 80% by weight of water.
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