Invention Publication
- Patent Title: MOLDED PANELS
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Application No.: US18098089Application Date: 2023-01-17
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Publication No.: US20230150198A1Publication Date: 2023-05-18
- Inventor: Chien-Hua CHEN , Michael W. Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- The original application number of the division: US16495472 2019.09.19
- Main IPC: B29C64/209
- IPC: B29C64/209 ; B33Y30/00 ; B29D99/00 ; B41J2/14 ; B41J2/16

Abstract:
A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.
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