Invention Application
- Patent Title: FE-BASED ALLOY AND ELECTRONIC COMPONENT INCLUDING THE SAME
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Application No.: US17736347Application Date: 2022-05-04
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Publication No.: US20230015154A1Publication Date: 2023-01-19
- Inventor: Sang Kyun Kwon , Chul Min Sim , Han Wool Ryu , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0088594 20210706
- Main IPC: C22C38/10
- IPC: C22C38/10 ; C22C38/14 ; C22C38/12 ; C22C38/08 ; C22C38/02 ; C22C38/00 ; H01F1/153 ; H01F27/255
Abstract:
A Fe-based alloy represented by a composition of (Fe(1-a)M1a)100-b-c-d-e-f-gM2bM3cBdPeCufTig, wherein M1 is at least one element selected from the group consisting of Co and Ni, M2 is at least one element selected from the group consisting of Nb, Mo, Zr, Ta, W, Hf, Ti, V, Cr, and Mn, M3 is at least one element selected from the group consisting of Si, Al, Ga, and Ge, and a, b, c, d, e, f, and g satisfy the following content conditions: 0≤a≤0.5, 0
Information query
