Invention Publication
- Patent Title: STACKABLE INTEGRATED CIRCUIT CARDS
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Application No.: US18153858Application Date: 2023-01-12
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Publication No.: US20230153564A1Publication Date: 2023-05-18
- Inventor: Ved Prakash Sajjan Kumar Agarwal
- Applicant: Visa International Service Association
- Applicant Address: US CA San Francisco
- Assignee: Visa International Service Association
- Current Assignee: Visa International Service Association
- Current Assignee Address: US CA San Francisco
- Main IPC: G06K19/077
- IPC: G06K19/077 ; G06K19/07

Abstract:
Systems and methods allow for the integrated circuit cards (ICCs) to removably couple to each other and transmit information to an access device as a single device. One among the two or more ICCs coupled together may read data from the remaining ICCs and provide the data to an access device via contactless communication. The ICC may include a substrate; an integrated circuit embedded in the substrate; input ports exposed on a first surface of the substrate, and output ports exposed on a second surface of the substrate. The input ports and the output ports are electrically coupled to the integrated circuit. The output ports are configured to be removably coupled to the input ports of a second ICC.
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