Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE HAVING HYBRID CHANNEL STRUCTURE
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Application No.: US17576726Application Date: 2022-01-14
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Publication No.: US20230154983A1Publication Date: 2023-05-18
- Inventor: Kang-ill Seo , Sooyoung Park , Byounghak Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/786 ; H01L21/8234 ; H01L29/66

Abstract:
A semiconductor device includes: a substrate; at least one hybrid channel structure formed on the substrate and including at least one 1st channel structure extended in 1st and 2nd directions in parallel with an upper surface of the substrate without directly contacting the substrate, and a 2nd channel structure connected to and intersecting the at least one 1st channel structure in a 3rd direction perpendicular to the 1st or 2nd direction; a gate structure surrounding the hybrid channel structure; and source/drain regions respectively formed at two opposite ends of the at least one hybrid channel structure in the 1st direction.
Information query
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