An electronic device is disclosed, including: a plurality of electrical components, a substrate including a circuit electrically connected to the electrical component, wherein a through hole is formed penetrating the substrate in a thickness direction from an upper surface of the substrate, a cable, a head part coupled to an end portion of the cable, and a socket part including a contact pin of which at least a portion thereof is disposed inside the through hole and extends laterally with respect to a lower surface of the substrate, so as to be electrically connected to the substrate, and coupled to the head part in a direction of the upper surface of the substrate.