Invention Application
- Patent Title: ELECTRONIC DEVICE COMPRISING A CHIP AND AT LEAST ONE SMT ELECTRONIC COMPONENT
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Application No.: US17945822Application Date: 2022-09-15
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Publication No.: US20230015669A1Publication Date: 2023-01-19
- Inventor: David AUCHERE , Claire LAPORTE , Deborah COGONI , Laurent SCHWARTZ
- Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Alps) SAS
- Applicant Address: FR Grenoble; FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Alps) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Alps) SAS
- Current Assignee Address: FR Grenoble; FR Grenoble
- Priority: FR1911129 20191008
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/31

Abstract:
An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.
Public/Granted literature
- US11756874B2 Electronic device comprising a chip and at least one SMT electronic component Public/Granted day:2023-09-12
Information query
IPC分类: