Invention Publication
- Patent Title: WEAK MATERIAL PHASES
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Application No.: US17544541Application Date: 2021-12-07
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Publication No.: US20230173746A1Publication Date: 2023-06-08
- Inventor: Wei Huang , Jun Zeng
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Main IPC: B29C64/141
- IPC: B29C64/141 ; B33Y10/00 ; B33Y80/00

Abstract:
Examples of methods are described. In some examples, a method may include printing a first solid material phase region. In some examples, the method may include printing a second solid material phase region distanced from the first solid material phase region. In some examples, the method may include printing a plurality of distanced beams, each having a thickness that is not more than one millimeter, to form a weak material phase region between the first solid material phase region and the second solid material phase region. In some examples, the weak material phase region has a volumetric density less than one.
Public/Granted literature
- US11865769B2 Weak material phases Public/Granted day:2024-01-09
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