Invention Application
- Patent Title: REFERENCE SIGNAL BUNDLING ENHANCEMENTS
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Application No.: US17757558Application Date: 2020-12-15
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Publication No.: US20230017463A1Publication Date: 2023-01-19
- Inventor: Yi HUANG , Alexandros MANOLAKOS , Wanshi CHEN , Wei YANG
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Priority: GR20190100566 20191219
- International Application: PCT/US2020/065169 WO 20201215
- Main IPC: H04L5/00
- IPC: H04L5/00 ; H04L25/02

Abstract:
Methods, systems, and devices for wireless communication are described. A wireless device may receive bundling indicators for a plurality of downlink transmissions and corresponding downlink assignment indicators associated with the bundling indicators, determine a demodulation reference signal (DMRS) bundling configuration based on the bundling indicators and the corresponding downlink assignment indicators, and process demodulation reference signals according to the DMRS bundling configuration. A wireless device may also receive bundling indicators for a plurality of downlink transmissions, determine a demodulation reference signal (DMRS) bundling configuration based on the bundling indicators and a gap between successive transmissions of the plurality of downlink transmissions, and process demodulation reference signals according to the DMRS bundling configuration.
Information query