Invention Publication
- Patent Title: IN-SITU DEPOSITION THICKNESS MONITORING
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Application No.: US17925182Application Date: 2021-08-10
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Publication No.: US20230184533A1Publication Date: 2023-06-15
- Inventor: Charles Andrew Paulson , Dean Michael Thelen
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- International Application: PCT/US2021/045300 2021.08.10
- Date entered country: 2022-11-14
- Main IPC: G01B7/06
- IPC: G01B7/06 ; C23C16/34 ; C23C16/36 ; C23C16/52

Abstract:
A method for in-situ measurement of a thickness of a coating deposited by a deposition process, includes the steps of initiating deposition within a deposition chamber such that a first coating forms on an outer surface of a probe disposed in the deposition chamber, wherein the probe comprises a coil assembly including at least one coil, wherein the probe is separated by a distance from a substrate disposed within the deposition chamber; exciting the coil assembly with a first alternating current to produce a first time-varying magnetic field, the first time-varying magnetic field generating an eddy current in the first coating; determining a metric related to an inductance or resistance of the coil assembly, wherein a value of the metric is related to a first thickness of the first coating and results at least partially from an eddy current magnetic field produced by an eddy current in the coating; and correlating the first thickness of the first coating to a second thickness of a second coating deposited on a surface of the substrate.
Public/Granted literature
- US12098918B2 In-situ deposition thickness monitoring Public/Granted day:2024-09-24
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