Invention Publication
- Patent Title: CONNECTION BODY AND HARNESS
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Application No.: US17970829Application Date: 2022-10-21
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Publication No.: US20230187855A1Publication Date: 2023-06-15
- Inventor: Kentaro TODA
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP 21199793 2021.12.09
- Main IPC: H01R12/62
- IPC: H01R12/62 ; H05K1/11 ; H01R12/71 ; H05K1/02

Abstract:
A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.
Information query
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