Invention Publication
- Patent Title: FABRICATION OF COOLING HOLES USING LASER MACHINING AND ULTRASONIC MACHINING
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Application No.: US17557224Application Date: 2021-12-21
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Publication No.: US20230193772A1Publication Date: 2023-06-22
- Inventor: Zhigang Wang , John D. Riehl , Andrew J. Lazur , Robin H. Fernandez , Paul F. Croteau , Gajawalli V. Srinivasan , Ashley A. Smith
- Applicant: RAYTHEON TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee: RAYTHEON TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Main IPC: F01D9/06
- IPC: F01D9/06 ; B23K26/382 ; B23K26/146 ; B23B35/00 ; G06F30/20

Abstract:
A method of machining cooling holes includes providing a workpiece in which a cooling hole is to be formed. The cooling hole, once formed, defines distinct first and second sections. The workpiece is secured in a fixture that is mounted in a first machine. In the first machine, a laser is used to drill a through-hole in a wall of the workpiece. The through-hole is spatially common to the first and second sections of the cooling hole. After drilling the through-hole, the fixture with the workpiece secured therein is removed from the first machine and mounted in a second machine. In the second machine, ultrasonic machining is used to expand a portion of the through-hole to form the second section. An abrasive slurry used in the process is drained through the through-hole during the ultrasonic machining.
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