Invention Publication
- Patent Title: SUPERCONDUCTING QUANTUM CHIP
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Application No.: US18108585Application Date: 2023-02-11
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Publication No.: US20230195988A1Publication Date: 2023-06-22
- Inventor: Kehui YU , Lijing Jin
- Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Current Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijng
- Priority: CN 2210129160.0 2022.02.11
- Main IPC: G06F30/39
- IPC: G06F30/39 ; G06N10/00

Abstract:
A method is provided. The method includes: obtaining a parameter value of a determined dimension parameter, an initial parameter value of a dimension parameter to be optimized, and a target capacitance value of an interdigital capacitor; partitioning a geometric structure of the interdigital capacitor to obtain a plurality of sections of the interdigital capacitor, where the plurality of sections are in a one-to-one correspondence with a plurality of coplanar multiple-transmission line models; obtaining a capacitance value expression of the interdigital capacitor based on the plurality of coplanar multiple-transmission line models; determining, based on the parameter value of the determined dimension parameter, the target capacitance value, and the capacitance value expression of the interdigital capacitor, a loss function including the dimension parameter to be optimized; and optimizing, based on the initial parameter value by minimizing the loss function, the parameter value of the dimension parameter to be optimized.
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