Invention Publication
- Patent Title: MICROFLUIDIC CHIP AND FABRICATION METHOD
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Application No.: US17684719Application Date: 2022-03-02
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Publication No.: US20230211345A1Publication Date: 2023-07-06
- Inventor: Wei LI , Baiquan LIN , Kaidi ZHANG , Yunfei BAI , Ping SU , Kerui XI , Zhenyu JIA
- Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
- Current Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Priority: CN 2111647733.0 2021.12.30
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B81B3/00 ; B81C1/00

Abstract:
A microfluidic chip and a fabrication method of the microfluidic chip are provided. The microfluidic chip includes an array substrate, and a hydrophobic layer disposed on a side of the array substrate. The hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate. The microfluidic chip also includes at least one hydrophilic structure. A hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole.
Public/Granted literature
- US12134097B2 Microfluidic chip and fabrication method Public/Granted day:2024-11-05
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