- 专利标题: ADHESIVE TAPE AND ELECTRONIC DEVICE
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申请号: US17808791申请日: 2022-06-24
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公开(公告)号: US20230022110A1公开(公告)日: 2023-01-26
- 发明人: Yoshimi Furukawa , Yuuya Kitade , Yuusuke Takahashi , Takeshi Iwasaki
- 申请人: DIC Corporation
- 申请人地址: JP Tokyo
- 专利权人: DIC Corporation
- 当前专利权人: DIC Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2021-113395 20210708
- 主分类号: C09J7/26
- IPC分类号: C09J7/26 ; C09J7/50 ; C09J183/04 ; C09J11/06
摘要:
Provided is an adhesive tape that has satisfactory conformability to a high step of an adherend while maintaining high impact resistance, and has removable performance that enables easy peeling when articles, such as electronic devices, are disassembled. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed therebetween. The foam base has a tensile strength of 650 N/cm2 or more in a flow direction, a compressive strength at 25% of 1000 kPa or less, and a density of 0.35 g/cm3 to 0.90 g/cm3.