Invention Publication
- Patent Title: POLYAMIC ACID SOLUTIONS, POLYIMIDE FILMS AND ELECTRONIC DEVICES
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Application No.: US18193224Application Date: 2023-03-30
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Publication No.: US20230235139A1Publication Date: 2023-07-27
- Inventor: MING-SIAO HSIAO
- Applicant: DUPONT ELECTRONICS, INC.
- Applicant Address: US DE WILMINGTON
- Assignee: DUPONT ELECTRONICS, INC.
- Current Assignee: DUPONT ELECTRONICS, INC.
- Current Assignee Address: US DE WILMINGTON
- The original application number of the division: US17471080 2021.09.09
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08G73/10
Abstract:
A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.
Public/Granted literature
- US11834561B2 Polyamic acid solutions, polyimide films and electronic devices Public/Granted day:2023-12-05
Information query
