Invention Publication
- Patent Title: FOAMABLE RESIN COMPOSITION, MOLDED RESIN FOAM, AND PRODUCTION METHOD THEREFOR
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Application No.: US18183420Application Date: 2023-03-14
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Publication No.: US20230312900A1Publication Date: 2023-10-05
- Inventor: Koki TANAKA , Yasushi NIMI , Kazuyoshi FUJIMOTO
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Kiyosu-shi
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Kiyosu-shi
- Priority: JP 22053737 2022.03.29
- Main IPC: C08L25/06
- IPC: C08L25/06 ; C08J9/232

Abstract:
A foamable resin composition includes a styrenic thermoplastic elastomer and a dynamically crosslinked thermoplastic elastomer in a total amount of 100 parts by mass. An amount of the dynamically crosslinked thermoplastic elastomer is 10 to 40 parts by mass. The composition further includes high-temperature expandable microcapsules and low-temperature expandable microcapsules in a total amount of 25 to 50 parts by mass relative to 100 parts by mass of the elastomers, and an amount of the low-temperature expandable microcapsules is 17 to 67% by mass relative to the total amount of the two types of microcapsules.
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