- 专利标题: COVERS FOR ELECTRONIC DEVICES
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申请号: US17788361申请日: 2020-01-08
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公开(公告)号: US20230031605A1公开(公告)日: 2023-02-02
- 发明人: Kuan-Ting Wu , Chi Hao Chang , Chien-Ting Lin
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: US TX Spring
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Spring
- 国际申请: PCT/US2020/012749 WO 20200108
- 主分类号: C25D11/30
- IPC分类号: C25D11/30 ; H04M1/02 ; C25D11/02 ; C25D11/24
摘要:
This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.
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