- 专利标题: SURFACE SENSITIZATION FOR HIGH-RESOLUTION THERMAL IMAGING
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申请号: US18304244申请日: 2023-04-20
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公开(公告)号: US20230324228A1公开(公告)日: 2023-10-12
- 发明人: Junqiao Wu , Kechao Tang , Kaichen Dong
- 申请人: The Regents of the University of California
- 申请人地址: US CA Oakland
- 专利权人: The Regents of the University of California
- 当前专利权人: The Regents of the University of California
- 当前专利权人地址: US CA Oakland
- 主分类号: G01J5/04
- IPC分类号: G01J5/04 ; G01J5/0801 ; G01J5/08 ; G01J5/48 ; G01J5/00
摘要:
A structured product, comprising: at least two layers comprising a first layer and a second layer; wherein: the first layer comprises at least one material having a temperature-dependent (e.g., a positive temperature-dependent or a negative temperature-dependent) wavelength-integrated emissivity (ε); the second layer comprises at least one reflective material that is reflective to light in an 8-14 μm wavelength range; and the structured product has a positive temperature-dependent wavelength-integrated emissivity. The structured product is useful in a method for thermal image sensitizing, the method comprising imaging, in an infrared spectrum, the structured product.
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