A packaging structure comprising a first antenna layer on a protective layer, a dielectric layer, a first plastic packaging layer over the first antenna layer, a second conductive pillar, a chip, a redistribution layer, and a second plastic packaging layer, the first conductive pillar is electrically connected to the first antenna layer, the dielectric layer is formed over the first conductive pillar, the second antenna layer is electrically connected to the first conductive pillar, the second conductive pillar is formed over the dielectric layer and electrically connected to the second antenna layer, the chip layer is formed over the dielectric layer, the redistribution layer is provided with conductive bumps and electrically connected to the chip and the second antenna layer, and the second plastic packaging layer encapsulates the second antenna layer and the chip. Chip and multiple antennas are packaged with one carrier substrate, reducing size.