- 专利标题: SHOE AND MIDSOLE MOLDING METHOD
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申请号: US17960553申请日: 2022-10-05
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公开(公告)号: US20230339200A1公开(公告)日: 2023-10-26
- 发明人: Min-Chih SHIH , Cheng-Yu SHIH , Cheng-Lung SHIH
- 申请人: Min-Chih SHIH , Cheng-Yu SHIH , Cheng-Lung SHIH
- 申请人地址: TW New Taipei City
- 专利权人: Min-Chih SHIH,Cheng-Yu SHIH,Cheng-Lung SHIH
- 当前专利权人: Min-Chih SHIH,Cheng-Yu SHIH,Cheng-Lung SHIH
- 当前专利权人地址: TW New Taipei City
- 优先权: TW 1115053 2022.04.20
- 主分类号: B29D35/14
- IPC分类号: B29D35/14
摘要:
A midsole molding method includes the following steps: creating an upper surface model of a midsole based on a personalized foot information and a human factor information; installing or forming the upper surface model on a bottom of the production mold; and placing the upper surface model inside a sole mold, to form the midsole between the upper surface model and the sole mold. Through the above molding method, the midsole can have ergonomic designs to have the support of insoles, to rectify the gait, or to relieve partial pressure etc. The disclosure can offer a foot-improving effect without the need to place insoles inside the shoe.
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