- 专利标题： ELECTRONIC DEVICE COVERS WITH COMPOSITE MATERIAL
-
申请号： US17790815申请日： 2020-02-04
-
公开(公告)号： US20230034118A1公开(公告)日： 2023-02-02
- 发明人: Stacy L. Wolff , Eric Wright Chen , Ilchan Lee , Chad Patrick Paris , Woojin Chung
- 申请人： Hewlett-Packard Development Company, L.P.
- 申请人地址： US TX Spring
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Spring
- 国际申请： PCT/US2020/016585 WO 20200204
- 主分类号： G06F1/16
- IPC分类号： G06F1/16
摘要：
An example electronic device includes a first housing having a first cover and a second cover, where the first cover is made from fibre composite material, where the second cover is made from metal, and where the first cover is bonded to the second cover via adhesive. The electronic device also includes a display device disposed in the first housing.
信息查询
