发明申请
- 专利标题: INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
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申请号: US17709920申请日: 2022-03-31
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公开(公告)号: US20230034551A1公开(公告)日: 2023-02-02
- 发明人: Wooram KI , Dongcheol PARK , Yonghun JI , Yongsang YUN
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR10-2021-0098746 20210727,KR10-2021-0128844 20210929
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K1/05 ; H04M1/02
摘要:
An electronic device is disclosed, including: a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface, a first printed circuit board (PCB) disposed on the first surface of the housing, a second PCB disposed on the first surface of the housing and spaced apart from the first PCB, a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB, a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB, and an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.
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