Invention Publication
- Patent Title: CONTAINER INCLUDING RFID MODULE
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Application No.: US18355868Application Date: 2023-07-20
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Publication No.: US20230359847A1Publication Date: 2023-11-09
- Inventor: Noboru KATO
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-shi
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP 21008975 2021.01.22
- Main IPC: G06K19/02
- IPC: G06K19/02 ; G06K19/077 ; G06K19/07 ; H01Q1/22 ; H01Q1/38

Abstract:
A container is provided includes a base material having insulating properties that form an outer shape, a metal film on the base material, and a first slit in the metal film. The base material includes a first surface, a second surface, and a first flap continuous with the first surface. The first slit separates the metal film on the first flap into first and second metal regions. An RFID module includes an RFIC element, a filter circuit, and first and second electrodes connected to the filter circuit. The first electrode and the first metal region are electrically connected to each other. The second electrode and the second metal region are electrically connected to each other. The first metal region is continuous with the metal film on the first surface and the second metal region is capacitively coupled to the metal film on the second surface.
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