- 专利标题: ELECTRONIC APPARATUS COMPRISING WATERPROOF STRUCTURE
-
申请号: US18360275申请日: 2023-07-27
-
公开(公告)号: US20230371192A1公开(公告)日: 2023-11-16
- 发明人: Sunggun CHO , Dongik LEE , Minyee AN , Wonhee CHOI , Hyunseung YOON , Heekang YUN , Waneui JUNG
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20210012050 2021.01.28
- 主分类号: H05K5/02
- IPC分类号: H05K5/02 ; H05K5/06
摘要:
According to an embodiment of the present disclosure, an electronic apparatus comprises: a housing; a first connector positioned on a printed circuit board accommodated in the housing and comprising a first hole configured to receive a first external connector; a second connector comprising a second hole configured to receive a second external connector; a first seal having a ring shape positioned in the first connector around the first hole; and a second seal having a ring shape positioned in the second connector around the second hole, wherein, based on the first seal being compressed in a first direction by the housing, the second seal may be compressed by the housing in a second direction perpendicular to the first direction.
信息查询