发明公开
- 专利标题: MASK BLANK, PHASE SHIFT MASK, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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申请号: US18034656申请日: 2021-12-02
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公开(公告)号: US20230393457A1公开(公告)日: 2023-12-07
- 发明人: Osamu NOZAWA , Hitoshi MAEDA
- 申请人: HOYA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: HOYA CORPORATION
- 当前专利权人: HOYA CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP 20204126 2020.12.09
- 国际申请: PCT/JP2021/044247 2021.12.02
- 进入国家日期: 2023-04-28
- 主分类号: G03F1/32
- IPC分类号: G03F1/32
摘要:
Provided is a mask blank. A mask blank comprising a phase shift film on a transparent substrate, the phase shift film having a structure in which a first layer, a second layer, and a third layer are layered in this order on the transparent substrate, the first layer and the third layer including hafnium and oxygen, and the second layer including silicon and oxygen, wherein when thicknesses of the first layer, the second layer, and the third layer are represented by D1, D2, and D3, respectively, all relationships of (Expression 1-A) to (Expression 1-D) are satisfied, or all relationships of (Expression 2-A) to (Expression 2-D) are satisfied.
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